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2018

Publications

P. Borgesen, L. Wentlent, S. Hamasha, S. Khasawneh, S. Shirazi, D. Schmitz, T. Alghoul, C. Greene, L. Yin, “A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints,” J. Electr. Mater. vol. 47, issue 5, pp. 2526-2544, May 2018.

J. Cho, F. Dong, L. Yin, D. Shaddock, “Effects of the Interlayer Thickness and Alloying on the Reliability of Transient Liquid Phase (TLP) Bonding,” Proceedings of the 68th Electronic Components and Technology Conference, ECTC 2018, San Diego, CA, May 29-June 1, 2018, pp. 551-556. (IEEC, NLAB)

Aref Ghafouri, Mingfei Zhao, Timothy J. Singler, Xin Yong, Paul Chiarot, “Interfacial Targeting of Sessile Droplets Using Electrospray,” Langmuir, vol. 34 issue 25, pp. 7445-7454, June 26, 2018. 

Jisun Hong, Kyongsei Cho, Seungbae Park, Shuai Shao, Yuling Niu, Huayan Wang, Van Lai Pham, “Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management,” in Proc. 68th ECTC, San Diego, 2018, pp. 682-692. 

S. Mallampati, L. Yin, D. Shaddock, H. Schoeller, J. Cho, "Lead-Free Alternatives for Interconnects in High-Temperature Electronics," Journal of Electronic Packaging, vol. 140, issue 1, pp. 010906-010912, Jan. 4, 2018. (IEEC, ADL)

Y. Niu, V. Pham, J. Wang, S. B. Park, “An Accurate Experimental Determination of Effective Strain for Heterogeneous Electronic Packages With Digital Image Correlation Method,” IEEE Trans. Components, Packag. Manuf. Technol., April 2018, vol. 8, pp. 1–11. 

Van Lai Pham, Yuling Niu, Jing Wang, Huayan Wang, Shuai Shao, Charandeep Singh, Seungbae Park; Cheng Zhong, Sau Wee Koh, Jifan Wang, “Experimentally Minimizing the Gap Distance Between Extra Tall Packages and PCB Using the Digital Image Correlation(DIC) Method,” in Proc. 68th ECTC, San Diego, 2018, pp. 1593-1599. 

Shuai Shao, Yuling Niu, Jing Wang, Ruiyang Liu, Seungbae Park, Hohyung Lee, Gamal Refai-Ahmed, Laurene Yip, “Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling,” in Proc.68th ECTC, San Diego, 2018, pp1668-1675. 

Jing Wang, Yuling Niu, Seungbae Park, Alexander Yatskov, “Modeling and Design of 2.5D Package with Mitigated Warpage and Enhanced Thermo-Mechanical Reliability,” 68th ECTC, San Diego, 2018, pp. 2477-2483. 

 Jiefeng Xu, Yuling Niu, Stephen R. Cain, S.B. Park, Scott McCann, Hohyung Lee, and Gamal Refai-Ahmed, “The Experimental and Numerical Study of Electromigration in 2.5D Packages,” in Proc. 68th ECTC, San Diego, 2018, pp. 483-489. 

Conference Presentations

P. Borgesen, L. Wentlent, T. Alghoul, S. Joshi, R. Sivasubramony, M. Yadav, S. Thekkut, J. L. Then Cuevas, L. E. Alvarez, C. Greene, “A Mechanistic Model for the Life of Solder Joints under Realistic Long-Term Service Conditions,” presented at 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Toulouse, France, April 15-18, 2018, pp. 1-11. 

J. Cho, F. Dong, H. Fallahdoost, P. Sivakumar, L. Yin, D. Shaddock, “Effect of the Interlayer Thickness and Alloying on the Reliability of Transient Liquid Phase (TLP) Bonding,” presented at The 68th IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA, May 29 – June 1, 2018. (IEEC, NLAB)

Nik Dimitrov, “Copper Superconformal Filling of High Aspect Ratio through Glass Holes Using MTT Additive: Plug Formation, Quality of the Fill, and MTT Reduction,” invited Talk at 234th AiMES Meeting of The Electrochemical Society, Cancun, Mexico, October 2018. (IEEC)

Nik Dimitrov, “Superconformal Filling of through Glass Holes for Application in Glass Interposers,” invited talk at 233th Meeting of the Electrochemical Society, Seattle, WA, May 2018. 

Nourma Khader, Sang Won Yoon, "Stencil printing process optimization to control solder paste volume transfer efficiency," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 9, pp. 1686-1694, June 12, 2018. 

Nourma Khader, Sang Won Yoon, Debiao Li. ''Online control of stencil printing parameters using reinforcement learning approach." In Proceedings of the 28th International Conference on Flexible Automation and Intelligent Manufacturing, Columbus, OH. June 11-14, 2018. 

B. Lee, R. Katkar, G. Gao, G. Fountain, S. Lee, L. Wang, C. Mandalapu, C. Uzoh, L. Mirkarimi, B. Sykes, M. Litjens, Y. Niu, S. Shao, J. Wang, S. Park, “Mechanical Strength Characterization of Direct Bond Interfaces for 3D-IC and MEMS Applications,” in Proc. 68th ECTC, San Diego, 2018, pp. 954-961. 

      

2017

Publications

R. I. Grynko, D. L. Weerawarne, B. Shim, “Effects of higher-order nonlinear processes on harmonic generation phase matching,” Physical Review A, vol. 96, p. 013816, July 10, 2017. 

Nourma Khader, Sang Won Yoon, Debiao Li, "Stencil printing optimization using a hybrid of support vector regression and mixed-integer linear programming," Procedia Manufacturing, Vol. 11. Sept. 18, 2017, pp. 1809-1817. 

J. Lombardi, M. D. Poliks, W. Zhao, S. Yan, N. Kang, J. Li, J. Luo, C.J. Zhong, Z. Pan, M. Almihdhar, B. S. Hsiao, “Nanoparticle Based Printed Sensors on Paper for Detecting Chemical Species,” in proceedings of the 2017 IEEE 67th Electronic Components and Technology Conference, Orlando, FL, May 30-June 2, 2017, pp. 2377-5726. 

 C. Singh, S. Chaparala, S. B. Park, “Measurement of Dynamic Response Parameters of an Underdamped System” in Dynamic Behavior of Materials, Volume 1: Proceedings of the 2016 Annual Conference on Experimental and Applied Mechanics, D. Casem, L. Lamberson, and J. Kimberley, Eds. Cham: Springer International Publishing, 2017, pp. 59–67. 

 J. Cho, R. Sheikhi, S. Mallampati, L. Yin, and D. Shaddock, “Bismuth-Based Transient Liquid Phase (TLP) Bonding as High-Temperature Lead-Free Solder Alternatives,” Proceedings of the 67th Electronic Components and Technology Conference, pp. 1553-1559, Lake Buena, FL, May 30-June 2, 2017.

Danielle L. McCarthy, Jian Liu, Derek B. Dwyer, Jennifer L. Troiano, Steven M. Boyer, Jared B. DeCoste, William E. Bernier, Wayne E. Jones, Jr., “Electrospun metal-organic framework polymer composites for the catalytic degradation of methyl paroxon,” RSC New Journal of Chemistry, vol. 41(17), pp. 8748-8753, June 19, 2017.

Y. Niu, H. Wang, and S. B. Park, “A general strategy of In-Situ Warpage Characterization for Solder Attached Packages with Digital Image Correlation Method,” Opt. Lasers Eng., vol . 93pp. 9-18, June 2017.

 Y. Niu, J. Wang, and S. B. Park, “The Complete Packaging Reliability Studies through One Digital Image Correlation System,” proceedings of the 67th ECTC, pp. 1916-1921, May 30-June 2, 2017.

S. Shao, D. Liu, Y. Niu, K. O’Donnell, d. Sengupta, and S.B. Park, “A study on the Thermomechnaical Reliability Risks of Through-Silicon-Vias in Sensor Applications,” Sensors, vol. 17, 2, p. 322, Feb. 9, 2017.

Matthew Wahila, Jennifer Amey-Proper, Wayne E. Jones Jr., Nancy Stamp, Louis Piper,“Teaching advanced science concepts through freshman research immersion.” European Journal of Physics, vol. 38, pp. 025704, February 3, 2017.

Haifeng Wang, Sang won Yoon, “A Machine Learing Model for Medical Image Recognition using Texture-Based Features,” Proceedings of the 2017 Industrial Systems Engineering Research Conference, pp. 20-23, Pittsburgh, PA, May 24, 2017.

 J. Wang, R. Liu, D. Liu, and S. B. Park, “Advancement in Simulating Moisture Diffusion in Electronic Packages under Dynamic Thermal Loading Conditions,” Microelectron. Reliab., vol. 73, pp. 42053, April 19, 2017.

Xin Wen, Brandon Okraszewski, Pragun Babber, James Cash, Stephen Cain, and David Klotzkin,"Effects of High‐g Impact on Physical, Electrical, and Optical Characteristics of Light‐Emitting Diodes." Journal of Forensic Sciences, May 8, 2017.

Conference Presentations

S. Mallampati, L. Ying, D. Shaddock, H. Schoeller, J. Cho, “Lead-Free Alternatives for Interconnects in High-Temperature Electronics,” presented at ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, CA, Aug. 29-Sept. 1, 2017. 

J. Cho, R. Sheikhi, S. Mallampati, L. Yin, D. Shaddock, “Bismuth-Based Transient Liquid Phase (TLP) Bonding as High-Temperature Lead-Free Solder Alternatives,” presented at The 67th IEEE Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, May 30-June 2, 2017.

 J. Cho, R. Sheikhi, S. Mallampati, L. Yin, and D. Shaddock, “Bismuth-Based Transient Liquid Phase (TLP) Bonding,” invited presentation at the Universal Instruments – AREA Consortium Meeting, Binghamton, NY, June 14, 2017.   

 Wayne E. Jones, Jr., “Poly(3,4-ethylenedioxythiophene) (PEDOT) Infused TiO2 Nanofibers for Photocatalytic Decontamination of Mustard Gas Simulant,”American Chemical Society National Meeting, Washington DC, August 20-24, 2017.

Wayne E. Jones, Jr.  “Functionalizing Fibers and Textiles Workshop,” Natick Army Research Labs, June 21, 2017.

 Wayne E. Jones, Jr., “Nanofibrous Photocatalysts, Sensors, and Multi-functional Materials, DoD Working Group,” UCSD, San Diego, CA, March 16, 2017.

James Turner, “A Flexible Hybrid Electronics (FHE) Wearable Biometric Human Performance Monitor (BHPM),” FlexTech Conference, Exhibit Demonstration, Monterey CA, June 19-22, 2017.

James N. Turner, Madina Zabran, Sandeep Mittal, Jenny Pawlak, Yang Gao, Varun Soman, Hussam Alothman, Jack Lombardi, Pravakar Rajbhandari, Benson Chan, Kanad Ghose, Mark Poliks, Zhanpeng Jin, Tara Dhakal, Mark Schadt, Frank Egitto, Paul Hart, William Wilson, Kostas Papathomas, Michael Gaige, Robert Welte, Yasser Khan, Donggeon Han, Natasha A. D. Yamamoto, Ana Arias and Dale Wilson, “A Flexible Hybrid Electronics Wearable Biometrid Human Performance Monitor,” Flexi Conference, Monterey CA, June 19-22, 2017.

Madina Zabran, Sandeep Mittal, Jenny Pawlak, Yang Gao, Varun Soman, Hussam Alothman, Jack Lombardi, Pravakar Rajbhandari, Benson Chan, Kanad Ghose, Mark Poliks, Zhanpeng Jin, Tara Dhakal, Mark Schadt, Frank Egitto, Paul Hart, William Wilson, Kostas Papathomas, Michael Gaige, Robert Welte, Yasser Khan, Donggeon Han, Natasha A. D. Yamamoto, Ana Arias, Dale Wilson, and James N. Turner, “Architecture and Assessment of a Wearable Biometric Human Performance Monitor (BHPM), Flexi Conference, Monterey CA, June 19-22, 2017.

Poster Presentations

R. Sheikhi, S. Mallampati, R. Tobias, and J. Cho, “Development of Transient Liquid Phase (TLP) Bonding,” poster presented at the 1st Multi-CAT Collaboration Symposium, Syracuse, NY, March 22 – 24, 2017.

     

2016

Journal Articles

Steve Boyer, Jian Liu, Sandy Zhang, Matthew Ehrlich, Danielle L. McCarthy, Linyue Tong, Jared DeCoste, William E. Bernier, Wayne E. Jones, Jr.“The Role of Ruthenium Photosensitizers in the Degradation of Phenazopyridine with TiO2 Electrospun Fibers,” Journal of Photochemistry and Photobiology A: Chemistry, vol. 329, 46-53, 2016.

Eric Cotts, Jiye Fang, Wayne E. Jones Jr., David Klotzkin, Greta Myers, Bruce White, “Work in Progress – A STEM Program Focused on Transfer tudent Success at Binghamton University,”,IEEE-Frontiers in Education, 2016.

Anting Chen, Wei Wu, William Bernier, Wayne E. Jones, Jr. “Polymers and Molecular Wires as Sensors”, book chapter in Comprehensive Supramolecular Chemistry II, Elsevier, New York, 2016.

H.W. Cheng, M. J. Schadt, C.J. Zhong. “ Assessing the Role of Capping Molecules in Controlling Aggregative Growth of Gold Nanoparticles in Heated Solution,” Chem. Asian J., 11, 120-127, 2016.

Y. Kim, A. Y. Park, C. L. Kao, M. Su, B. Black, and S. Park. “Prediction of deformation during manufacturing processes of silicon interposer package with TSVs.” Microelectron. Reliab., vol. 65, pp. 234–242, 2016. 

Jian Liu, Danielle L. McCarthy, Linyue Tong, Michael J. Cowen, John M. Kinsley, Laura Sonnenberg, Kenneth H. Skorenko, Jared B. DeCoste, William E. Bernier, Wayne E. Jones, Jr., “Poly (3,4-ethylenedioxythiophene) (PEDOT) Infused TiO2 Nanofibers: the Role of Hole Transport Layer in Photocatalytic Degradation of Phenazopyridine As a Pharmaceutical Contaminant,” RSC Advances, vol.  6, pp. 113884-113892, 2016.

Jian Liu, Danielle McCarthy, Michael Cowan, Emilly Obuya, Jared DeCoste, William Bernier, Wayne E. Jones, Jr. “Mechanism and Optimization of the Photocatalytic Activity for TiO2 Nanofibers with Variable Rutile Fraction.” Applied Catalysis B, vol.187, 154-162, 2016.

Ah-Young Park, S. C. Chaparala, and S. B. Park, “Risk assessment of the crack propagation and delamination of the Cu-to-Cu direct bonded (CuDB) interface,” Microelectron. Reliab., vol. 66, pp. 113–121, 2016.

H. Schoeller and J. Cho. “Superplasticity from Viscous Flow in High Pb Ternary Alloy”. Materials Science and Engineering A, 658, pp. 210-220 (2016).

Kenneth Skorenko, Rose Bernier, Jian Liu, Brad Galusha, Frank Goroleski, William Bernier, Jeffrey Mativetsky, Wayne E. Jones, Jr.“Thermal Stability of Nanoparticle Bound Organic Chromophores with ZnO,” Dyes and Pigments, vol. 131, 69-75, 2016.

Linyue Tong, Jian Liu, Steven M. Boyer, Laura A. Sonnenberg, Maggie T. Fox, Dongsheng Ji, Jun Feng, William Bernier, Wayne E. Jones, Jr. “Vapor-phase polymerized poly(3,4-ethylenedioxythiophene) (PEDOT)/TiO2 composite fibers as electrode materials for supercapacitors.”, Electrochimica Acta, 2016, 224, 133-141. 2016.

E. H. Wong and S. B. Park. “Microelectronics Reliability Moisture diffusion modeling – A critical review.” Microelectron. Reliab., vol. 65, pp. 318–326, 2016. 

Steve Boyer, Jian Liu, Sandy Zhang, Matthew Ehrlich, Danielle L. McCarthy, Linyue Tong, Jared DeCoste, William E. Bernier, Wayne E. Jones, Jr., “The Role of Ruthenium Photosensitizers in the Degradation of Phenazopyridine with TiO2 Electrospun Fibers.” Journal of Photochemistry and Photobiology A: Chemistry, vol. 329, pp. 46-53, October 2016.

 Eric Cotts, Jiye Fang, Wayne E. Jones Jr., David Klotzkin, Greta Myers, Bruce White, “Work in Progress – A STEM Program Focused on Transfer student Success at Binghamton University.” IEEE-Frontiers in Education, pp. 1-4, October 2016.

Courtney Edwards, Daryl Santos, “Efficacy of the NEH Heuristic in a Hybrid Flow Shop Environment”, Proceedings of the 5th Annual World Conference of the Society for Industrial and Systems Engineering, San Francisco Bay Area, CA, October 13-14, 2016.

Jian Liu, Danielle L. McCarthy, Linyue Tong, Michael J. Cowen, John M. Kinsley, Laura Sonnenberg, Kenneth H. Skorenko, Jared B. DeCoste, William E. Bernier, Wayne E. Jones, Jr., “Poly (3,4-ethylenedioxythiophene) (PEDOT) Infused TiO2 Nanofibers: the Role of Hole Transport Layer in Photocatalytic Degradation of Phenazopyridine As a Pharmaceutical Contaminant.” RSC Advances, vol., 6, pp. 113884-113892, December 2016.

Y. Niu, S. Shao, S.B. Park and C. L. Kao,” Prediction of deformation during manufacturing processes of Silicon Interposer Package with TSVs,” Microelectron. Reliab, vol. 65, pp. 234-242, October 2016.

Kenneth Skorenko, Rose Bernier, Jian Liu, Brad Galusha, Frank Goroleski, William Bernier, Jeffrey Mativetsky, Wayne E. Jones, Jr.. “Thermal Stability of Nanoparticle Bound Organic Chromophores with ZnO.” Dyes and Pigments, vol. 131, pp. 69-75, March 11, 2016.

Linyue Tong, Jian Liu, Steven M. Boyer, Laura A. Sonnenberg, Maggie T. Fox, Dongsheng Ji, Jun Feng, William Bernier, Wayne E. Jones, Jr., “Vapor-phase polymerized poly(3,4-ethylenedioxythiophene) (PEDOT)/TiO2 composite fibers as electrode materials for supercapacitors.” Electrochimica Acta, vol. 224, pp. 133-141, December 5, 2016.

E. H. Wong and S. B. Park, “Microelectronics Reliability Moisture Diffusion Modeling – A Critical Review,” Microelectron. Reliab., vol. 65, pp. 318-326, October 2016.

Articles in Conference Proceedings

T. Alghoul, D. Watson, N. Adams, S. Khasawneh, F. Batieha, C. Greene, and P. Borgesen. "Constitutive Relations for Finite Element Modeling of SnAgCu in Thermal Cycling – How Wrong We Were!," Proceedings of  ECTC 2016.

P. Borgesen, S. Hamasha, L. Wentlent, D. Watson, and C. Greene. "Interpreting Accelerated Test Results for Lead Free Solder Joints,” in the Proceedings of the PanPac Conference, 2016.

J. Cho, S. Mallampati, R. Tobias, H. Schoeller, L. Yin, and D. Shaddock. “Exploring Bismuth as a New Pb-Free Alternative for High Temperature Electronics”. in Proceedings of the 66th Electronic Components and Technology Conference, May 31-June 3, 2016. pp. 432-438.         

R. Liu, H. Wang, J. Wang, H. Lee, S. B. Park, X. Xue, Y. Kim, S. Saiyed, and D. Sengupta, “Moisture Diffusion and 66th  Swelling of Adhesives in Electronics Packaging,” in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, pp. 2203–2209. 

Y. Niu, H. Lee, and S. B. Park, “A new in-situ warpage measurement of a wafer with speckle -free digital image correlation (DIC) method,” in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp. 425–431. 

Y. Niu, H. Wang, S. Shao, and S. B. Park, “In-Situ Warpage Characterization of BGA Packages with Solder Balls Attached during Reflow with 3D Digital Image Correlation (DIC),” in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, pp. 782–788. 

S. Shao, D. Liu, Y. Niu, and S. Park, “Die stress in stealth dicing for MEMS,” in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016, pp. 539–545. 

Anju Sharma, Preeth Sivakumar, Andrew Feigel, In Tae Bae, Lawrence P. Lehman, Joseph Gregor, James Cash & Joseph Kolly, “Effects of x-ray exposure on NOR and NAND flash memories during high-resolution 2D and 3D x-ray inspection”, published in proceedings (and presented  by Anju Sharma) in IMAPS 2016 – 49th International Symposium on Microelectronics – Pasadena, CA, USA, Oct 10-13, (2016), pp 660-665. (ADL, IEEC)

C. Singh, S. Chaparala, C. Zhou, B. Zhang, and S. B. Park, “Deformation of Display for Handheld Devices during Drop Impact,” in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, pp. 1990–1995. 

Preeth Sivakumar, Jack P. Lombardi, Stephen R. Cain, Mark Poliks, James Cash, Joseph Gregor, and Michael Budinski, "Fire Damage and Repair Techniques for Flash Memory Modules: Implication for Post-Crash Investigations," International Symposium on Microelectronics, Vol. 2016, No. 1, pp. 648-652, Fall 2016. 

J. Wang and S. Park, “Non-linear Finite Element Analysis on Stacked Die Package Subjected to Integrated Vapor-Hygro-Thermal-Mechanical Stress,” in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, pp. 1394–1401.

Conference Presentation

J. Cho. “Exploring Bismuth as a New Pb-Free Alternative for High Temperature Electronics,” presented at Universal Instruments, AREA Consortium Meeting, Binghamton, NY, March 30, 2016. 

J. Cho, S. Mallampati, R. Tobias, R. Sheikhi, H. Schoeller, L. Yin, and D. Shaddock, “Exploring Bismuth as a New Pb-Free Alternative for High Temperature Electronics  presented at The 66th IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, May 31 – June 3, 2015.      

 J. Cho, S. J. Meschter, and S. Maganty, “Microstructure and Property Assessments of UV-Curable Conformal Coatings for Pb-Free Electronics,”  presented at The International Conference on Soldering and Reliability (ICSR), Toronto, CANADA (May 10-12, 2016):    (ADL, IEEC)

Wayne E. Jones, Jr., “Global Factors Influencing Chemistry Employment in the US”, American Chemical Society National Meeting, San Diego, CA, 2016.

Wayne E. Jones, Jr., “Inorganic/Organic hybrid materials for photodegredation and environmental remediation,” Northwestern University, Evanston, IL, 2016.

Wayne E. Jones, Jr., “New materials for degredation of chemical warfare agents.” DOD working group, Raleigh, NC, 2016.

Wayne E. Jones, Jr., “Electrically Conducting Polymers for Electronics Applications.” SUNY Binghamton, Binghamton, NY 2016.

N. Kang, J. Kim, F. Lin, W. Zhao, M. Almihdhar, J. Lombardi, S. Yan, J. Luo, B.S. Hsiao, M.D. Poliks, C. Zhong, “ Characterization of electrical properties of nanoparticle-nanofibrous membranes,” (Poster), 2016: ACS NERM Meeting, Binghamton, NY, October 6-9, 2016. 

Ning Kang, Jack P. Lombardi, Fang Lin, Shan Yan, Juhee Kim, Mihdhar Almihdhar, Yvonne Xu, Brandon Burg, Jin Luo, Benjamin S. Hsiao, Mark D. Poliks, Chuan-Jian Zhong,  “PMSE Electrochemical Characterization of Nanoparticle-Nanofibrous Composites and Potential Application in Wearable Sensors,” 252nd ACS National Meeting, Philadelphia, August 21- 25, 2016. 

M. Kokash and P. Borgesen. "Sintered Ag and nano-Cu", AREA Consortium Meeting, Binghamton, NY, March 30, 2016. 

M. Kokash, P. Borgesen, A. A. Zinn, R. M. Stoltenberg, J. Chang, Y.L. Tseng, and D. Blass,. "High Temperature Solder Alternatives", Electronics Packaging Symposium, Binghamton, NY, Oct. 2016.

F. Lin, N. Kang, S. Yan, S. Shan, J. Luo, C. Zhong, “A Novel Nanoparticle-Paper Structured Sweat Sensor,” Nanotechnology: From Fundamentals to Applications (Oral),
2016: ACS NERM Meeting, Binghamton, NY, October 6-9, 2016. 

Jin Luo, Wei Zhao, shiyao shan, Jack P. Lombardi, Darshana Weerawarne, Thomas Rovere, Ning Kang, Zakiya Skeete, Yvonne Xu, Amber R. Vargas, Bonggu Shim, Benjamin S. Hsiao, Mark D. Poliks, Chuan-Jian Zhong, “ Understanding low-temperature sintering and adhesion properties of metal nanoparticles printed sensor devices,” ACS NERM Meeting, , Binghamton, NY, October 6-9, 2016. 

R. Sheikhi, S. Mallampati, R. Tobias and J. Cho. “Development of Transient Liquid Phase (TLP) Bonding as a High-Temperature Pb-Free Alternative,”  presented at the 2016 Electronics Packaging Symposium, Binghamton, NY, October 6-7, 2016.

R. Sheikhi, S. Mallampati, R. Tobias and J. Cho, “Bismuth-Nickel Transient Liquid Phase Bonds for High Temperature Electronics,”  presented at the 2016 MRS Fall Meeting & Exhibit. November 27 – December 2, 2016.

Preeth Sivakumar, Jack P. Lombardi, Stephen R. Cain, Mark Poliks, James Cash, Joseph Gregor, and Michael Budinski, "Fire Damage and Repair Techniques for Flash Memory Modules: Implication for Post-Crash Investigations," International Symposium on Microelectronics: FALL 2016, Vol. 2016, No. 1, pp. 648-652, 2016. 

Darshana L. Weerawarne, Ross I. Grynko, Bonggu Shim. "Dual-color time-resolved methods yield significant enhancement of third-harmonic generation in air,” presented at the American Chemical Society Northeast Regional Meeting, Oct. 5- 8, 2016. 

Shan Yan, Ning He, Chuan-Jian Zhong,  “ANYL A nanocomposite film derived from crosslinking bio-synthesized poly-gamma glutamic acid/chitosan and gold nanoparticles for detection of biomolecules,” 252nd ACS National Meeting, Philadelphia, August 21- 25, 2016.    

Shan Yan, Wei Zhao, Xin Liu, Zakiya Skeete, Jin Luo, Ivan G. Ivanov, Chuan-Jian Zhong, “Characterization of Functional Nanocomposites of Dendrons and Gold Nanoparticles,” 252nd ACS National Meeting, Philadelphia, August 21- 25, 2016.    

C. J. Zhong, “Nanoparticle-Structured Interfaces in Catalysis and Sensing,” (invited talk) in Coll, 252nd ACS National Meeting, Philadelphia, August 21- 25, 2016.

C. J. Zhong, “ Nanomaterials and Functional Devices for Clean Energy and Smart Sensors,” (Keynote talk), NanoWorld Conference, April 4 - 6, 2016, Newton, MA.

C. J. Zhong, “Assembly of Functional Nanomaterials and Flexible Sensors,” (invited talk) 5th Annual World Congress of Advanced Materials, Chongqing, May 6-8, 2016. 

R. Sheikhi, S. Mallampati, R. Tobias and J. Cho, “Development of Transient Liquid Phase (TLP) Bonding as a High-Temperature Pb-Free Alternative,” presented at the Electronics Packaging Symposium, Binghamton, NY, October 6-7, 2016.  

Poster Presentations

R. Sheikhi, S. Mallampati, R. Tobias and J. Cho, “Bismuth-Nickel Transient Liquid Phase Bonds for High Temperature Electronics,” poster presented at the 2016 MRS Fall Meeting & Exhibit, Boston, MA, November 27 – December 2, 2016.     

   

     

2015

Publications

Arfaei,B.,  F. Mutuku, R. Coyle, E. Cotts, “Influence of Microalloying elements on Reliability of SnAgCu Solder Joints” Proceedings of the Pan Pacific Microelectronics Symposium 2015.

Bae, I-T and H. Naganuma, “Evidence of rhombohedral structure within BiFeO3 thin film grown on SrTiO3”, Applied Physics Express, 8, 031501 (2015). 

Arfaei, B.,  F. Mutuku, R. Coyle, E. Cotts, J. Wilcox, “Failure Mechanism and Microstructural Evolution of Pb-free Solder Alloys in Thermal Cycling Tests: Effect of Solder Composition and Sn Grain Morphology” Proceedings of the Electronic Components Technology Conference 2015, San Diego, CA. 

Batieha, F., F. Feyissa, S. Hamasha, S. Shirazi, L. Wentlent, P. Ogutu, N. Dimitrov, E. Fey, and P. Borgesen, “Intermetallics Issues and Challenges in 2.5/3D Assembly Microjoints”, Proc. SMTA PanPac Conf. 2015. 

Cain, Stephen, William Infantolino, Allen Anderson, Edward Tasillo, Paul Wolfgramm, “Thermochemistry and Equilibration Time Scales for a Rechargeable Lithium Ion Battery“, Electrochimica Acta, 185 (2015) 250-258. 

Chauhan, A., B. Sammakia & K. Ghose, “Transient power analysis to estimate the thermal time lag of a microprocessor hot spot”, in Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st (pp. 75-81). IEEE.

Cho, J.,  S. Maganty, and S. J. Meschter, “Innovating the Microstructure of Polyurethane Conformal Coatings for Tin Whisker Mitigation”; pp. 718-725 in Proceedings of the SMTA International Conference 2015 (Rosemont, IL; September 27 – October 1, 2015). Published by SMTA, 2015.  (IEEC, ADL)

Cho, J., S. Mallampati, H. Schoeller, L. Yin, and D. Shaddock, “Developments of Bi-Sb-Cu Alloys as a High-Temperature Pb-Free Solder”; pp. 1251-1256 in Proceedings of the 65th Electronic Components and Technology Conference (ECTC 2015; San Diego, CA; May 26-29, 2015). Published by IEEE, 2015.     

Cho, J., S. J. Meschter, and S. Maganty, "Development of Polyurethane-Based Conformal Coatings for Pb-Free Electronics"; in Proceedings of the SMTA International Conference on Soldering & Reliability (Toronto, ON, Canada; May 19-21, 2015). Published by SMTA, 2015. (IEEC, ADL)

Cotts, E. and B. Arfaei, “Emerging Interconnects and Pb-free Materials for Advanced Electronic Packaging” J. of Metals 67,2381 (2015).

Cui, Weili; Wayne Jones, David Klotzkin, Greta Myers, Shawn Wagoner, Bruce White, “Realization of a Comprehensive Multidisciplinary Microfabrication Education Program at ��������Ƶ” IEEE-Transactions on Education, 2015, 58(1), 25-31. ADL, IEEC, CAMM, CASP

DeCaluwe, Steven C., Bal Mukund Dhar, Liwei Huang, Yuping He, Kaikun Yang, Bo Yang, Jon Owejan, Yiping Zhao, A. Alec Talin, Joseph A. Dura, and Howard Wang, “Pore collapse and regrowth in silicon electrodes for rechargeable batteries”, Physical Chemistry Chemical Physics, 17, 11301-11312 (2015). 

Gao, T., J. Geer & B. Sammakia, “Development and verification of compact transient heat exchanger models using transient effectiveness methodologies”, International Journal of Heat and Mass Transfer, 87, 265-278. IEEC, ES2

Hamasha, S., A. Sharma, B. Schnabl, L. Cheng, L. Desir, K. Bretz, L. Wentlent, A. A. Zinn, J. Beddow, K. Schnabl, E. Hauptfleisch, D. Blass, and P. Borgesen, “A NanoCopper Based Alternative to High Temperature Solder“, Proc. SMTA PanPac Conf., 2015.

He, Yuping, R. Gregory Downing, and Howard Wang, “3D Mapping of Lithium ion Battery Electrodes Using Neutron Activation”, Journal of Power Sources, 287, 226-230 (2015). 

He, Y. and H. Wang, “In Situ Neutron Techniques for Lithium Ion and Solid State Rechargeable Batteries”, chapter in Handbook for Solid State Batteries, West, W. et. al. Ed. (2015). 

Kansara, N., R. Katti, K. Nemati, A. P. Bowling, & B. Sammakia, “Neural Network Modeling in Model-Based Control of a Data Center”,  in ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (pp. V001T09A034-V001T09A034). American Society of Mechanical Engineers. 

Liu, Jian, Siva P Adusumilli, John J Condoluci, Alok C Rastogi, William E Bernier, Wayne E Jones, Jr., “Effects of H2 Annealing on Polycrystalline Copper Substrates for Graphene Growth during Low Pressure Chemical Vapor Deposition”  Materials Letters, 2015, 153, 132-135. ADL, IEEC, CAMM, CASP

Lutz, P. S., I.-T. Bae, and M. M. Maye, “Heterostructured Au/Pd-M (M=Au,Pd,Pt) nanoparticles with compartmentalized composition, morphology, and electrocatalytic activity”,  Nanoscale 7, 15748 (2015). 

McKeown, S., S. Meschter, P. Snugovsky, J. Kennedy, Z. Bagheri, J. Keeping, J. Cho, D. Edwards, K. Elsken, “Strategic Environmental Research and Development Program (SERDP) Nanoparticle enhanced conformal coating project: Coating modeling for tin whisker mitigation”; pp. 695-710 in Proceedings of the SMTA International Conference 2015 (Rosemont, IL; September 27 – October 1, 2015). Published by SMTA, 2015.   (IEEC, ADL)

Ogutu, P., e. Fey, and N. Dimitrov, “Superconformal Filling of High Aspect Ration through Glass Vias (TGV) for Interposer Application using TNBT and NTBC Additives”, Journal of the Electrochemical Society, 2015, 162 (:;9;), D457-464. 

Paranjothy, S. S., G. Subbarayan, D. Y. Jung & B. G. Sammakia, “An Inverse Procedure for Estimating the Anand Viscoplastic Constitutive Model Parameters for Copper Free-Air Ball”, in ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (pp. V002T01A009-V002T01A009). American Society of Mechanical Engineers. 

Poliks, Barbara, Cheng Chen, Bruce E. White Jr., Bahgat Sammakia, “Molecular Dynamics Simulations of Thermal Conductivity in Composites Consisting of Aluminum Oxide Nanoparticles Surrounded by Polyethylene Oxide”, Proceedings of the Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th, pp. 1920-1925.

Poliks, B., C. Chen, B. White, & B. Sammakia, “ Molecular Dynamics simulations of thermal conductivity in composites consisting of aluminum oxide nanoparticles surrounded by polyethylene oxide”, inElectronic Components and Technology Conference (ECTC), 2015 IEEE 65th (pp. 1920-1925). IEEE. 

Ranade, A. P., Jung, D. Y., Sammakia, B. G., Eilertsen, T., & Davis, T. (2016). Optimization study of Supercapacitor electrode material composition and thickness for enhanced performance of the Supercapacitor. une, 13, 15. 

Schoeller, H., S. Mallampati, and J. Cho, “Thermo-Mechanical Evaluation of Alternative Pb-Free Die Attach Materials”; pp. 657-665 in Proceedings of the SMTA International Conference 2015 (Rosemont, IL; September 27 – October 1, 2015). Published by SMTA, 2015.    

Slaton, R. D., I.-T. Bae, P. S. Lutz, L. Pathade, and M. M. Maye, “The transformation of alpha-Fe nanoparticles into multi-domain FeNi-M3O4 (M=Fe,Ni) heterostructures by galvanic exchange”,  Journal of Materials Chemistry C 3, 6367 (2015).

Skorenko, Kenneth, Austin Faucette, Nicholas Ravvin, William Bernier, Jeffrey Mativetsky, Wayne E. Jones, Jr.,  “Vapor Phase Polymerization and Mechanical Testing of Highly Conducting Poly(3,4-ethylenedioxythiophen) for Flexible Devices.” Synthetic Metals, 2015, 209, 297-303. 10/1016/j.synthmet.2015.07.033. ADL, IEEC, CAMM, CASP

Tong, Linyue, Kenneth Skorenko, Austin Faucette, Steve Boyer, Jian Liu, William Bernier, Jeffrey Mativetsky, Wayne E. Jones, Jr., “Detection and Differentiation of Ferrous and Ferric ions in Aqueous Systems using Fluorescent Metallopolymer and Oligomer Chemosensors.” J. Polymer Science B., 2015, 53, 951-955. ADL, IEEC, CAMM, CASP

 Tong, Linyue, Kenneth Skorenko, Austin Faucette, Steve Boyer, Jian Liu, William Bernier, Jeffrey Mativetsky, Wayne E. Jones, Jr., “Vapor Phase Polymerization of Poly(3,4-ethylenedioxythiophene) (PEDOT) on Carbon Coated Substrates as Enhanced Electrodes for Supercapacitors.” J. Power Sources, 2015, 297, 195-201. 10.1016/j.jpowsour.2015.06.128 ADL, IEEC, CAMM, CASP

Yuan, L., X. Chen, S. Maganty, J. Cho, C. Ke, and G. Zhou, “Enhancing the Oxidation Resistance of Copper by Using Sandblasted Copper Surfaces,” Applied Surface Science, in press (2015). (DOI: doi:10.1016/j.apsusc.2015.09.203)        

Zhou, S., Sammakia, B. G., White, B., Borgesen, P., & Chen, C. (2015). Multiscale modeling of Thermoelectric Generators for conversion performance enhancement. International Journal of Heat and Mass Transfer,81, 639-645. 

Conference Presentations

Arfaei, B., F. Mutuku, R. Coyle, E. Cotts, “Influence of Microalloying elements on Reliability of SnAgCu Solder Joints” Pan Pacific Microelectronics Symposium 2015 Kauai, HI 04/FEB/15.

Arfaei, B., F. Mutuku, R. Coyle, E. Cotts, J. Wilcox, “Failure Mechanism and Microstructural Evolution of Pb-free Solder Alloys in Thermal Cycling Tests: Effect of Solder Composition and Sn Grain Morphology” Electronic Components Technology Conference 2015, San Diego, CA 28/MAY/15.

Cho, J., S. Mallampati, H. Schoeller, L. Yin, and D. Shaddock, presented at The 65th IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA. (May 26-29, 2015): Developments of Bi-Sb-Cu Alloys as a High-Temperature Pb-Free Solder.      

Cho, J., S. J. Meschter, and S. Maganty, presented at The International Conference on Soldering and Reliability (ICSR), Toronto, CANADA (May 19-21, 2015): Development of Polyurethane-Based Conformal Coatings for Pb-Free Electronics.      (IEEC, ADL)

Cho, J.,  S. J. Meschter, and S. Maganty, presented at the SMTA International Conference 2015, Rosemont, IL (September 27 – October 1, 2015): Innovating the Microstructure of Polyurethane Conformal Coatings for Tin Whisker Mitigation.     (IEEC, ADL)

Cotts, E., “Effect of Processing Parameters on the Microstructural and Reliability of Pb-free Solder Alloys:  Effect of Solder Composition and Sn Grain Morphology” IEEE Joint CPMT/CAS & SMTA Oregon Chapters Seminar (in cooperation with IMAPS, IPC & EMA) Beaverton, OR 09/APR/15. 

Cotts, E., “Electronics Packaging of Integrated Circuits” ECE Departmental Seminar, Portland State University, Portland, OR 10/APR/15. 

Cotts, E.,“Nucleation and Growth: Effect of Cooling Rate on Precipitate Morphology of near-eutectic SnAgCu” Universal Instruments Consortium, Binghamton, NY 15/Oct/2015. 

Cotts, E.,“Phase Transformations in Nanostructure” ��������Ƶ Physics Department Colloquium, Binghamton, NY 2/Nov/2015. 

Cotts, E., “Nucleation and Growth: Effect of Cooling Rate on Precipitate Morphology of near-eutectic SnAgCu” Universal Instruments Consortium, Binghamton, NY 15/Oct/2015. 

Jones, W. E. Jr.,  “Electrospun composite nanofibers for enhanced photocatalytic degradation of environmental toxins,” Pacifichem International Meeting, Honolulu, HI, 2015. ADL, IEEC, CAMM, CASP

Jones, W. E. Jr., “Capturing the Power of the Sun:  Molecular Wires and Devices for Photovoltaics and Environmental Sensors,” New York ACS Local Section keynote address, St. Joseph’s College, Brooklyn, NY 2015. ADL, IEEC, CAMM, CASP

Lehman, Lawrence, "Controlling the Sn grain morphology of C4 solder bumps".presented at 2015 Rensselaer CATS / CEG Advanced Manufacturing Conference on Oct. 14, 2015. IEEC, ADL

Lehman, L. P., G. Parks, F. Mutuku and E. Cotts, “Effect of Processing Parameters on the Microstructure and Reliability of Pb-free Solder Joints” CATS/CEG Advanced Manufacturing Conference 2016.  Albany, NY 14/October/2015. 

Maganty, S.,  F. Dong, M. P. Roma, S. J. Meschter, and J. Cho, presented at Universal Instruments AREA Consortium, Binghamton, NY (October 14-15, 2015): Development of Polyurethane-Based Conformal Coatings for Pb-Free Electronics.         (IEEC, ADL)

Maganty, S., S. J. Meschter, and J. Cho, presented at Materials Science & Technology 2015 Conference & Exhibition (MS&T15), Columbus, OH (October 4-8, 2015): Developments of Conformal Composite Coatings for Tin Whisker Mitigation.     (IEEC, ADL)

McKeown, S., S. Meschter, P. Snugovsky, J. Kennedy, Z. Bagheri, J. Keeping, J. Cho, D. Edwards, and K. Elsken, presented at the SMTA International Conference 2015, Rosemont, IL (September 27 – October 1, 2015): Strategic Environmental Research and Development Program (SERDP) Nanoparticle Enhanced Conformal Coating Project: Coating Modeling for Tin Whisker Mitigation.  (IEEC, ADL)

Mutuku, F., E. Cotts and B. Arfaei, “Effect of Process and Sample Parameters on Microstructure and Mechanical Properties of Lead Free Solders” Universal Instruments Consortium, Binghamton, NY 15/Oct/2015. 

Schoeller, H., S. Mallampati, and J. Cho, presented at the SMTA International Conference 2015, Rosemont, IL (September 27 – October 1, 2015): Thermo-Mechanical Evaluation of Alternative Pb-Free Die Attach Materials.           

Invited Talks

Borgesen, Peter, “Nano-Cu Based Alternative to Solder”, and “‘Kirkendall’ Voiding in 2.5/3D Assembly Microjoints”, and “Interpreting Accelerated Test Results for Lead Free Solder Joints”, at Analog Devices, Boston, Dec. 18, 2015. 

Borgesen, Peter, “Nano-Cu Based Alternative to Solder” at Schlumberger, Paris, France, July 9, 2015. 

Borgesen, Peter, “Nano-Cu Based Alternative to Solder”, web cast to Schlumberger, Houston, TX, August 5, 2015. 

Borgesen, Peter, “Nano-Cu Based Alternative to Solder”, University of Bordeaux, France, July 8, 2015. 

Borgesen, Peter, “On the Nature and Behavior of SnAgCu Solder”, University of Bordeaux, France, June 26, 2015. 

Borgesen, Peter, “A Quantitative Mechanistic Understanding and Models for the Fatigue of SnAgCu in Isothermal and Thermal Cycling”, University of Bordeaux, France, July 1, 2015. 

Cho, J., presented at Analog Devices, Inc. (ADI), Wilmington, MA (August 5, 2015): Research Activities at Advanced Materials and Mechanics Laboratory.    

Cho, J., presented at Analog Devices, Inc. (ADI), Wilmington, MA (July 20, 2015): Overview of ADI Projects.     

Jones, W. E. Jr., “Hybrid Nanomaterials and Photocatalysis for Removing Environmental Toxins and Chemical Warfare Agents,” Natick Army Research Labs, Natick, MA, 2015. ADL, IEEC, CAMM, CASP

Jones, W. E. Jr., “Smart Energy:  New Technologies for a Modern World”, Lyceum, Binghamton, NY 2015. ADL, IEEC, CAMM, CASP

Jones, W. E. Jr.,  “Photocatalysis for Remediation of Environmental Wastes and Chemical Warfare Agents”, Canisius College, Buffalo, NY, 2015. ADL, IEEC, CAMM, CASP

Patents

Wang, H., Sammakia, B., Liu, Y., & Yang, K. (2015). U.S. Patent No. 9,017,808. Washington, DC: U.S. Patent and Trademark Office.